Silicone Thermal Liquid Gap Filler

 LiPOLY’s Putty Series is gap filler material with a thermal conductivity 3.5~10.0W/m*K, high deformation amount, extremely low thermal resistance, low stress, flexible gap adaptation, and excellent tolerance compensation feature can overcome overflow and dryness problems. Ideally suited for LiPOLY Smart Dispense Robot which is the best choice for automated dispensing production.

 

  • S-putty
    Datasheet
  • S-putty2-s
    Datasheet
  • H-putty
    Datasheet
  • H-putty2
    Datasheet
  • SH-putty3
    Datasheet
  • S-putty5-s
    Datasheet
  • Product Series Introduction

    Due to Internet of Things raise, electrical products has tendency to lighter, also with high power, high-speed, and high density. Because of the high power module pursued lighter, high density, high power, and the design of the chip and component pursued high capability, high baud, high efficiency, cause the waste heat and hotspot temperature rise quickly, which become the problem in desperate need to solve.